PURPOSE: To provide a glass ceramic substrate containing copper wiring which prevents strength and water resistance of a substrate from deteriorating due to changes in glass quality during baking.
CONSTITUTION: Borosilicate glass, which softens under a certain metal melting point in a region A, where foreign crystals are not deposited in the ternary system of composition, is treated as a parent metal at 45Vol%. For a filler metal, consider mullite 35%, alumina 10% and an inorganic materials which does not sinter under the metal melting point and which contains aluminum, and also consider an inorganic material not containing aluminum and quartz glass 10%. At these points, a green sheet and a wiring pattern are formed. Through heat treatment over the softening temperature of the parent metal and under the metal melting point, a glass ceramic substrate made into one unit is obtained.
USHIFUSA NOBUYUKI
TANEI HEIKICHI
MORITA KOSAKU
YASUZAKI NAOKO
