REPAIRING OF DISCONNECTIONS AND WIRING BOARD USING THAT METHOD

Title:

REPAIRING OF DISCONNECTIONS AND WIRING BOARD USING THAT METHOD

Document Type and Number:

Japanese Patent JPH0729982

Kind Code:

A

Abstract:

PURPOSE: To repair a disconnected section on a wiring board to such a state that there may be no difference between the disconnected section and a normal wiring having no disconnected section easily and accurately.

CONSTITUTION: This is a method for repairing a disconnected section 12 wherein laser light is cast on part of the disconnected section 12 which is brought into contact with a solution 3 containing a metal complex or a coating film containing a metal complex and then a metal thin film is locally deposited only at the laser light cast section of the disconnected section 12 and thereby the disconnected section 12 is repaired. In this method, the solution or the coating film should include a complex containing one or more kinds of metals from palladium, gold, silver, and platinum. By this method, a disconnected section on a wiring board 2 is repaired.

Inventors:

TODOROKI SATORU
OKUNAKA MASAAKI
HONGO MIKIO
NAKATANI MITSUO

Application Number:

JP16924393A

Publication Date:

January 31, 1995

Filing Date:

July 08, 1993

Export Citation:

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Assignee:

HITACHI LTD

International Classes:

H01L21/82; H01L21/3205; H01L23/52; H01S3/00; H05K3/22; (IPC1-7): H01L21/82; H01S3/00

Attorney, Agent or Firm:

Masami Akimoto

Next Patent: GENERATION OF VIRTUAL WIRING LENGTH