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Patent Searching and Data


Title:
FLUORESCENT LAMP
Document Type and Number:
Japanese Patent JPS599845
Kind Code:
A
Abstract:

PURPOSE: To make electric potential impartable to a metal film through connection in use of solder for metal film use, by setting the thickness of the metal film down to 10μm-100μm as well as making up a fluorescent lamp with an electrical connection method between the metal film and a lead wire in a lighting circuit performed by the solder for metal film use, in the case where a metal film adhesive tape is used as a proximity auxiliary conductor.

CONSTITUTION: According to illustration, this tape is made up of the following processes that an adhesive layer 2 is applied to the whole one side of a polyester layer 1 of width L and then a polyester layer 1' of width l(l<L), a polyester layer 3 as an adhesive layer and an aluminum film layer 4 of thickness d overlap each other. The aluminum film layer 4 being stuck on the polyester layer 1 is stuck on the surface of a fluorescent lamp FL by the adhesive layer 2. Thickness of the film layer is made to be 10μm in the lower limit so as not to be broken by tensile force while its upper limit is set down to 100μm in a bid to make soldering easy. And, at the end part of a proximity conductive tape being stuck to the fluorescent lamp FL, electrical connection to an electrode lead wire 5 of the fluorescent lamp FL takes place with aluminum solder 6.


Inventors:
OGAWA SOUICHIROU
Application Number:
JP11677582A
Publication Date:
January 19, 1984
Filing Date:
July 07, 1982
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H01J61/54; H01J61/36; (IPC1-7): H01J61/00
Attorney, Agent or Firm:
Toshiyuki Usuda