PURPOSE: To improve the mounting density of a semiconductor chip and arrange a formed display screen by a method wherein an electrode connecting part of the semiconductor chip is taken out at its back side and electrodes are mutually connected at the back side using a wiring pattern of support substrate.
CONSTITUTION: On a substrate 21 where a display drive circuit is integrated, a prescribed radius of piercing hole 22 is opened in advance at a part of it where an electrode junction part is expected to be formed. An oxide insulator film 23 is formed on the inner surface of the piercing hole 22 and the surface and back of the substrate 21 by the heat oxidation process while the display drive circuit is formed. A lead-out electrode pattern 24 formed on the substrate 21 is formed by adhesion, with the piercing hole 22 being covered. Then conductive film is selectively formed by adhesion on the inner surface of the piercing hole 22 and on the both circumferences of the hole, and an electrode connecting part 5 of the loading electrode pattern 24 is placed on the back side of the substrate 21 through this conductive connecting hole 22.
OOKAWA YASUSHI
MIURA TERUNOBU
