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Patent Searching and Data


Title:
WIRE BONDING METHOD
Document Type and Number:
Japanese Patent JPH07122587
Kind Code:
A
Abstract:

PURPOSE: To form a loop, wherein a neck is formed uprightly, when the electrodes and the leads of an integrated circuit are connected with gold wires.

CONSTITUTION: A piece of wire is stretched from the first bonding point to the second bonding point through the intermediate point at the height of a loop, which is separated by the moving distance L, with a bonding tool. At the time, the tool is made to pass the first and second intermediate points of the loop other than the intermediate point described above. The first loop intermediate point is set at the position, which is separated slightly from the first bonding point conversely with respect to the second bonding point.


Inventors:
FUJII HIDEKI
Application Number:
JP26931793A
Publication Date:
May 12, 1995
Filing Date:
October 28, 1993
Export Citation:
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Assignee:
NEC CORP
International Classes:
H01L21/60; G05B19/4093; (IPC1-7): H01L21/60; G05B19/4093
Domestic Patent References:
JPH03142941A1991-06-18
JPS6342135A1988-02-23
JPS62140427A1987-06-24
JPH05211193A1993-08-20
JPH06124973A1994-05-06
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)