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Patent Searching and Data


Title:
WIRING CABLE OF LAMINATED WIRING BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH07111113
Kind Code:
A
Abstract:

PURPOSE: To suppress the edge backing of the metallic conductor of a wiring cable.

CONSTITUTION: A wiring cable 100 has a structure in which a first metal layer 100a electrochemically more basic than a metallic conductor 1 is formed around the outer periphery of the metallic conductor 1 and a second metal layer 100b excellent in plastic workability and electrochemically more noble than the first metal layer 100a is formed around the outer periphery of the first metal layer 100a, with an insulating jacket 2 covering the outer periphery of the second metal layer 100b. Thus cathode corrosion resistance suppresses the edge backing caused by an etching electrolyte, so the reliability of connection between through-hole conductor layers can be enhanced.


Inventors:
HARADA HIDENORI
Application Number:
JP25552793A
Publication Date:
April 25, 1995
Filing Date:
October 13, 1993
Export Citation:
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Assignee:
TOTOKU ELECTRIC
International Classes:
B21F19/00; H01B13/00; H05K1/09; H05K3/10; H05K3/46; (IPC1-7): H01B13/00; B21F19/00; H05K1/09; H05K3/46
Attorney, Agent or Firm:
Arisa Shinshiro