PURPOSE: To increase resonance frequency by a method wherein the mutual interference between the input and output leads of radial form in the title package of the lamination of ceramic substrates is prevented by passing the inut high frequency current leakage in the package through ground leads.

CONSTITUTION: By exposing the chip-fixing part 2a, a frame substrate 3a is placed on a substrate 1a, and a shielding metallic layer 8a and an alumina layer 9a radially outward from the fixing part 2a are superposed on the upper surface of the frame. A slightly narrow metallic layer 4a is provided on the layer 9a with the same pattern, and is then covered again with the layer 9a. The metallic layer 4a is some exposed and covered with a shielding metallic layer 10a, connected to the ground external lead 12a along with the shielding layer 8a through a metallic layer 11a on the side surface after the lamination of a frame 5a, and further the metallic layer 4a for signal is connected to the external lead 7a via metallic layer 4a for signal is connected to the external lead 7a via metallic layer 6a on the side surface. The ground leads 12a are connected to each other by means of a metallic layer 13a on the back, and the leakage of the leads 7a for signal is prevented. This construction enables to effectively increase the point of the small-sized package.