Title:
【発明の名称】高周波デバイスパッケージ及びその製造方法
Document Type and Number:
Japanese Patent JP2861956
Kind Code:
B2
Abstract:
A high-frequency device package includes a base, a high-frequency device mounted on the base and having a power supply electrode, a signal electrode, and a ground electrode disposed on a surface thereof, a plurality of leads electrically connected respectively to the power supply electrode, the signal electrode, and the ground electrode using a tape carrier, and a resin body sealingly encasing the high-frequency device. The resin body is formed by dropping a molten resin mass onto the base in covering relation to the high-frequency device and thereafter solidifying the dropped resin mass to sealingly encase the high-frequency device.
Inventors:
KOIZUMI TAKAO
KOSUGI JUHEI
KOSUGI JUHEI
Application Number:
JP19472596A
Publication Date:
February 24, 1999
Filing Date:
July 24, 1996
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L21/60; H01L23/02; H01L23/04; H01L23/28; H01L23/31; H01L23/66; (IPC1-7): H01L23/04; H01L21/60; H01L23/28
Domestic Patent References:
| JP5152378A | ||||
| JP7297342A | ||||
| JP4348063A | ||||
| JP6164185A | ||||
| JP6112683A | ||||
| JP2125643A | ||||
| JP8167630A | ||||
| JP3161957A | ||||
| JP2260447A |
Attorney, Agent or Firm:
Wakabayashi Tadashi