Title:
【発明の名称】高安定パッケージ基板およびブロムインダン誘導体
Document Type and Number:
Japanese Patent JP2003509854
Kind Code:
A
Abstract:
A method of producing a highly stable packaging substrate in which are provided a first precursor having a first backbone and a first ethynyl group, and a second precursor having a second backbone and a second ethynyl group. Furthermore provided is a crosslinker having a first and a second reactive group. The first precursor, the second precursor, the crosslinker, and a solvent are applied onto a surface to form an electrically insulating layer. The first ethynyl group is reacted with the first reactive group in a first carbon-carbon bond formation reaction and the second ethynyl group is reacted with the second reactive group in a second carbon-carbon bond formation reaction to crosslink the first backbone with the second backbone, thereby forming the packaging substrate. The solvent is removed in a further step.
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Inventors:
Matsuka See, Thomas F.
Wagaman, Michael Davrill.
David, David
Wagaman, Michael Davrill.
David, David
Application Number:
JP2001523665A
Publication Date:
March 11, 2003
Filing Date:
September 14, 2000
Export Citation:
Assignee:
Allied Signal Incorporated
International Classes:
C08G61/00; C08G61/02; C08G85/00; C08G61/08; H01L23/14; H01L23/29; H05K1/03; (IPC1-7): H01L23/14; C08G85/00