Title:
TERMINAL CONNECTING STRUCTURE OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPS6035595
Kind Code:
A
Inventors:
ONO TAIICHI
Application Number:
JP14379883A
Publication Date:
February 23, 1985
Filing Date:
August 08, 1983
Export Citation:
Assignee:
ALPS ELECTRIC CO LTD
International Classes:
H01R4/04; B29C65/40; G09F9/35; H05K3/36; H05K3/32; (IPC1-7): B29C65/40; G09F9/35; H01R4/04; H05K3/36
Domestic Patent References:
JPS54144494A | 1979-11-10 | |||
JPS5670529A | 1981-06-12 |
Attorney, Agent or Firm:
Kenjiro Take
Previous Patent: Multilayer structure
Next Patent: MOLD FOR BONDING LAMINATED LAYER OF MULTILAYER PRINTED CIRCUIT BOARD
Next Patent: MOLD FOR BONDING LAMINATED LAYER OF MULTILAYER PRINTED CIRCUIT BOARD