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Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0726073
Kind Code:
A
Abstract:

PURPOSE: To provide a thermoplastic resin compsn. improved in flowability esp. during molding thereof and solvent and oil resistances without detriment to the appearance, mechanical properties, dimensional accuracy, electrical properties and heat resistance of a molded product thereof.

CONSTITUTION: 20-80 pts.wt. polyphenylene ether, 20-80 pts.wt. polyolefin and/or polycarbonate, and 0.1-10 pts.wt. arom. hydrocarbon-formaldehyde resin are melt-kneaded together to prepare a thermoplastic resin compsn.


Inventors:
OKUZONO TOSHIAKI
KANO YUICHI
Application Number:
JP16703193A
Publication Date:
January 27, 1995
Filing Date:
July 06, 1993
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08L23/00; C08L59/00; C08L61/18; C08L69/00; C08L71/00; C08L71/12; C08L87/00; (IPC1-7): C08L23/00; C08L23/00; C08L61/18; C08L69/00; C08L71/12



 
Next Patent: POLYOLEFIN RESIN FILM