PURPOSE: To improve the characteristics of a semiconductor pressure converter by interposing an insulating film between the surface of a silicon substrate to be mounted with a diaphragm pressure sensitive element and a glass film, thereby improving the insulation and preventing the pinholes from producing.
CONSTITUTION: A mounting base 13 which bonds a diaphragm type pressure sensitive element 11 integrally formed wth a gauge resistance element 12 on the outer surface is formed to a silicon substrate 13A having thermal expansion coefficient equal to that of the element 11, and a dioxidized silicon film 14 is thermally oxidized integrally with the element bonding surface of the substrate 13A. Then, a borosilicate glass film 15 is laminated by a sputtering on the film, thereby forming the base 13. Then, the element 11 is anodically bonded to the base 13.
SHIMAZOE MICHITAKA
MATSUOKA YOSHITAKA
