Title:
OUTER LEAD CORRECTING APPARATUS
Document Type and Number:
Japanese Patent JPH0645493
Kind Code:
A
Abstract:
PURPOSE: To improve flatness of an end of an outer lead of a surface mounting type resin-sealed IC irrespective of a warpage of a package.
CONSTITUTION: A lower block 3 for positioning to hold an IC 1', a holding block 7' for pressing an IC to the lower block, and a punch 4' for vertically moving to bend oppositely to the lower block are used, positioned to be held without correcting a warpage of a package, an end of an outer lead 2 is lifted, and a flatness of an end of the lead is improved.
Inventors:
SHIOZAKI AKIO
Application Number:
JP19440992A
Publication Date:
February 18, 1994
Filing Date:
July 22, 1992
Export Citation:
Assignee:
NEC CORP
International Classes:
B21D1/06; H01L23/50; (IPC1-7): H01L23/50; B21D1/06
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)
Next Patent: PACKAGE FOR SEMICONDUCTOR INTEGRATED CIRCUIT