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Patent Searching and Data


Title:
HYBRID INTEGRATED CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPH0730061
Kind Code:
A
Abstract:

PURPOSE: To provide a hybrid integrated circuit device which is lessened in size as a whole and wherein a wiring circuit board connected to a hybrid integrated circuit is easily supported.

CONSTITUTION: Circuit elements are fixed through the intermediary of an electrical path of required pattern formed on the primary surface of an insulating board, external lead terminals 13 and 14 used for signals and a power supply are connected to the electrical path at prescribed points, the tips of the lead terminals 13 and 14 are led out to the primary surface of the board, and circuit elements 21 are mounted on an arranged hybrid integrated circuit 10. Furthermore, a wiring circuit board 20 is connected through the intermediary of holes where the lead terminals 13 and 14 are inserted, and a lead wiring 30 extending from an external circuit and interconnected to both the hybrid integrated circuit 10 and the wiring circuit board 20 is directly connected to the power outer lead terminal 14 which protrudes from the wiring circuit board 20.


Inventors:
SAKAMOTO NORIAKI
OKAWA KATSUMI
Application Number:
JP15525193A
Publication Date:
January 31, 1995
Filing Date:
June 25, 1993
Export Citation:
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Assignee:
SANYO ELECTRIC CO
International Classes:
H01L23/48; H01L25/07; H01L25/18; H05K1/14; H05K3/34; (IPC1-7): H01L25/18; H01L23/48
Attorney, Agent or Firm:
Takuji Nishino