Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH0669208
Kind Code:
A
Abstract:
PURPOSE: To obtain a uniform wiring resistance by preventing the random discontinuity of A1 in a laminated wiring of aluminum and a conductive layer with a high melting-point.
CONSTITUTION: When a compressed part 14 is provided at certain predetermined intervals in a laminated wiring, discontinuity of A112 can be controlled at the compressed part 14 in a heat treatment after a wiring 11 is formed. Also, when the discontinuity is brought about, stress is released, so that after that, the random discontinuity of A112 due to stress migration and electromigration can be prevented.
Inventors:
ONODA HIROSHI
Application Number:
JP7032491A
Publication Date:
March 11, 1994
Filing Date:
March 12, 1991
Export Citation:
Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01L21/3205; H01L21/768; H01L23/52; H01L21/28; H01L23/528; H01L23/532; (IPC1-7): H01L21/3205; H01L21/28
Attorney, Agent or Firm:
Toshiaki Suzuki
Next Patent: スタック送信処理装置