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Patent Searching and Data


Title:
SYNTHETIC RESIN MOLDING AND METHOD FOR MOLDING THE SAME
Document Type and Number:
Japanese Patent JPH068256
Kind Code:
A
Abstract:

PURPOSE: To obtain a synthetic resin molding capable of being assembled without considering the surface and rear of the molding.

CONSTITUTION: Molds 11, 12 are filled with a synthetic resin material and the synthetic resin material is compressed at high temp. to form a molding having the same shape as the cavity of the molds. Subsequently, compression is released and an ejector pin 19 is made to protrude from the surfaces of the molds to take out the molding from the molds. In this molding method, the position of the ejector pin is arranged in opposed relation to the surface area convered with other member when the molding is assembled and the molding is pressed by the ejector pin.


Inventors:
KURIKI ITARU
NAKAYAMA TAKESHI
Application Number:
JP19170092A
Publication Date:
January 18, 1994
Filing Date:
June 25, 1992
Export Citation:
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Assignee:
BRIDGESTONE CORP
International Classes:
B29C33/44; B29C43/50; B29C45/40; (IPC1-7): B29C33/44; B29C43/50; B29C45/40
Attorney, Agent or Firm:
Suzuki Etsuro