PURPOSE: To provide a wafer dicing method which prevents an increase in both a device installation space and a manufacturing cost, and what is more, obtains easily required chips.
CONSTITUTION: After a cutter 5 is aligned on a center line L of a specified dicing line 2 as illustrated in FIGURE 1 (a), a first cutting area 10 of a first stripe is formed along the center line L as illustrated in FIGURE 1 (b). Then, a second cutting area 11 of a second stripe is formed along a center line M where the cutter 5 is shifted by A to the right side from the center line L as illustrated in FIGURE (c). Furthermore, the cutter 5 is shifted by A to the left side from the center line L and a third cutting area 12 of a third stripe is formed along a center line N as illustrated in FIGURE (d), thereby providing semiconductor chips which eliminate aluminum thin film parts 4.
MASUDA HISAO
OZEKI YUKIO
