Title:
FORMATION OF THIN FILM CIRCUIT
Document Type and Number:
Japanese Patent JPH0653406
Kind Code:
A
Abstract:
PURPOSE: To provide a circuit forming method being employed in the fabrication of semiconductor device or thin film circuit in which number of steps is decreased and reliability is enhanced.
CONSTITUTION: In the process for forming a thin film circuit, dielectric film 4 for thin film capacitor is deposited simultaneously with interlayer insulation film 5 of thin film inductor in order to decrease the number of steps thus forming a highly reliable thin film circuit.
Inventors:
MURAI TOMOHIKO
TAKEBAYASHI MIKIO
TAKEBAYASHI MIKIO
Application Number:
JP20076792A
Publication Date:
February 25, 1994
Filing Date:
July 28, 1992
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01F17/00; H01G4/40; H01L21/822; H01L27/01; H01L27/04; H03H7/01; H05K1/16; (IPC1-7): H01L27/01; H01F17/00; H01G4/40; H01L27/04; H05K1/16
Attorney, Agent or Firm:
Akira Kobiji (2 outside)
Next Patent: 硬貨包装機の包装紙詰まり検知装置