Title:
【発明の名称】レーザ穴開け加工装置
Document Type and Number:
Japanese Patent JP3346374
Kind Code:
B2
Abstract:
A laser hole boring apparatus comprising a galvanomirror beam scanning system, a DOE beam diffraction system and a selecting device for the two systems optionally. The DOE system bores many holes simultaneously on printed circuit boards or packages by converting a laser beam into two dimensional diffraction beams and converging the diffraction beams by an f sin θ lens into spots on the object (board, package). The galvanomirror system bores many holes sequentially on printed circuit boards or packages by scanning a pulse laser beam in two dimensions and converging the scanned beam by an f sin θ lens into a spot on the object.
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Inventors:
Keiji Fuse
Application Number:
JP2000154514A
Publication Date:
November 18, 2002
Filing Date:
May 25, 2000
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
G02B26/00; B23K26/06; B23K26/066; B23K26/067; B23K26/073; B23K26/382; G02B5/18; G02B13/18; G02B26/10; H05K3/00; B23K101/42; (IPC1-7): B23K26/00; B23K26/06; G02B5/18; G02B13/18; G02B26/00; G02B26/10; H05K3/00
Domestic Patent References:
| JP8276288A | ||||
| JP1158055A | ||||
| JP1034365A | ||||
| JP287109A | ||||
| JP5157967A | ||||
| JP651196A |
Attorney, Agent or Firm:
Shigeki Kawase