Title:
【発明の名称】無鉛はんだ合金
Document Type and Number:
Japanese Patent JP3152945
Kind Code:
B2
Abstract:
A lead-free solder which is comprised of three elements Sn-Cu-Ni. Cu and Ni are 0.1 - 2 wt% and 0.002 - 1 wt% respectively. Preferable weight percentage of Cu and Ni are 0.3 to 0.7 percent and 0.04 to 0.1 percent respectively. Both methods of additive Ni to a base alloy of Sn-Cu and additive Cu to a base alloy of Sn-Ni are applicable.
Inventors:
Tetsuro Nishimura
Application Number:
JP54805399A
Publication Date:
April 03, 2001
Filing Date:
March 15, 1999
Export Citation:
Assignee:
Nippon Superior Co., Ltd.
International Classes:
B23K35/26; C22C13/00; H05K1/09; H05K3/34; B23K; C22C; (IPC1-7): B23K35/26; C22C13/00
Domestic Patent References:
| JPS62230493A | 1987-10-09 |
Other References:
「第４回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム論文集」（１９９８−１−２９）社団法人溶接学会ｐ．２８５−２８８
Attorney, Agent or Firm:
Toshiaki Hamada