Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH0715116
Kind Code:
A
Abstract:
PURPOSE: To elevate the electric reliability of a printed wiring board by hindering the exfoliation of wiring.
CONSTITUTION: In a printed wiring board, which has wiring 2A being formed on one surface of a substrate 1 and being provided with a cut area 2A1 to be cut according to circuit change, the areas 2A2 on both sides of the cutting region 2A1 of the wiring 2A are so constituted as to have larger adhesion areas per unit length L than those in other areas of the wiring 2A to be bonded to the substrate 1.
Inventors:
KATAOKA MIWAKO
SAITO MITSUO
IKEDA KAZUFUMI
SAITO MITSUO
IKEDA KAZUFUMI
Application Number:
JP15727793A
Publication Date:
January 17, 1995
Filing Date:
June 28, 1993
Export Citation:
Assignee:
HITACHI LTD
HITACHI DEVICE ENG
HITACHI DEVICE ENG
International Classes:
H05K1/02; H05K3/22; H05K1/00; H05K1/11; (IPC1-7): H05K3/22; H05K1/02
Attorney, Agent or Firm:
Akita Aki