Title:
【発明の名称】リソグラフィ接触要素
Document Type and Number:
Japanese Patent JP2002531915
Kind Code:
A
Abstract:
A method of forming an interconnection, including a spring contact element, by lithographic techniques. The method comprises successively patterning a first and a second layer of masking material (125, 140) over a substrate (105), each layer of masking material having an opening; depositing a first conductive material (130) after patterning said first layer of masking material and depositing a second conductive material (145) after patterning said second layer of making material to form an electromechanical contact element having: a first portion (130) formed in an opening in said first masking material layer (125) and a second portion (145) coupled to the first portion and formed in an opening in said second masking material layer (140); and removing the plurality of layers of masking material.
Inventors:
Matthew, Gaetan, El
Eldridge, Benjamin, N
Groove, Gary, W
Eldridge, Benjamin, N
Groove, Gary, W
Application Number:
JP2000585674A
Publication Date:
September 24, 2002
Filing Date:
December 01, 1999
Export Citation:
Assignee:
Form Factor, Incorporated
International Classes:
G01R1/073; G01B7/34; G01N27/00; G01R1/067; G01R3/00; H01L21/48; H01L21/60; H01L21/66; H01L23/48; H01R12/16; H01R33/76; H05K3/32; H05K3/40; (IPC1-7): H01R33/76; G01R1/073; H01L21/66; H01R12/16
Attorney, Agent or Firm:
Kaoru Furuya (2 outside)