Title:
RADIATION-CURING PRESSURE-SENSITIVE ADHESIVE AND PRESSURE-SENSITIVE ADHESIVE TAPE
Document Type and Number:
Japanese Patent JPH0657216
Kind Code:
A
Abstract:
PURPOSE: To provide a radiation-curing pressure-sensitive adhesive of a solvent- free coating type excellent in the balance between adhesion and holding power after being cured with a radiation and capable of exhibiting a good adhesion even to a polyolefin.
CONSTITUTION: A radiation-curing pressure-sensitive adhesive comprises 100 pts.wt. acrylic polymer prepd. from an acrylic monomer of the formula: CH2=C (R1)COOR2 (wherein R1 is hydrogen or methyl; and R2 is 1-14C alkyl) as the main monomer and having a glass transition temp. of at most -20°C, 5-50 pts.wt. alicyclic resin mainly contg. a 5-6C alicyclic structure, and 1-30 pts.wt. monomer having at least one radiation-reactive unsatd. bond in the molecule thereof.
Inventors:
KAMIYA KATSUHIKO
ANDO MASAHIKO
YAMAMOTO KAZUHIKO
MOROISHI YUTAKA
ANDO MASAHIKO
YAMAMOTO KAZUHIKO
MOROISHI YUTAKA
Application Number:
JP23771292A
Publication Date:
March 01, 1994
Filing Date:
August 12, 1992
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C09J4/06; C09J4/00; C09J4/02; C09J7/02; (IPC1-7): C09J4/06; C09J4/06; C09J7/02
Attorney, Agent or Firm:
Ogi
Next Patent: 傘