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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0625527
Kind Code:
A
Abstract:

PURPOSE: To give a resin composition containing a polyamino-phenylene ether comprising 2 kinds of specific structural units and a polyamide resin, exhibiting excellent compatibility between both the resin components to give good component dispersion, high mechanical strength and good surface appearance of the molded products.

CONSTITUTION: This resin composition contains (A) a polyaminophenylene ether copolymer consisting of (i) structural units of formula I {(m) is 1 to 4; (n) is 0 to 3 where m+n≤4; J is formula II [(a) is 1 to 6; R1 is 1 to 20C aliphatic hydrocarbon which may be substituted with halogen atoms and whose chain may be interrupted with 0 atoms, aromatic polyvalent hydrocarbon; R2 is alkylene; R3, R4 are H, 1 to 20C alkyl], when (m) is ≥2, R3 and R4 may mutually be different; K is halogen, primary or secondary alkyl and when (n) is ≥2, each may differ from one another}, and (ii) structural units of formula III (Q is H, halogen) and having a number-average polymerization degree of 25 to 500, and (B) a polyamide resin, preferably nylon-6, preferably at a A/B weight ratio of (70 to 30)/(30 to 70).


Inventors:
KIHIRA MICHIHARU
TSUKAHARA TORU
NISHIMURA HIROMI
Application Number:
JP18233692A
Publication Date:
February 01, 1994
Filing Date:
July 09, 1992
Export Citation:
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Assignee:
MITSUBISHI PETROCHEMICAL CO
International Classes:
C08L71/12; C08L77/00; (IPC1-7): C08L71/12; C08L77/00
Attorney, Agent or Firm:
Hajime Tsukuni (1 person outside)