Title:
【発明の名称】メモリ素子
Document Type and Number:
Japanese Patent JP3367512
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a memory element with a small chip size. SOLUTION: A film carrier 2 is applied onto the surface of a chip 22. An opening part 41 for exposing the pad on the surface of the chip 22 is formed on the film carrier 23. A frame body 25 is formed around the opening 41, a synthetic resin 26 is coated to the inside of the frame body 25 for sealing a pad, a wire, or the like. Also, a solder ball is mounted onto the pad of a circuit pattern 50 of the film carrier 23 and is heated for melting and hardening, thus forming a bump 24.
Inventors:
Kazuhiro Noda
Application Number:
JP2000212359A
Publication Date:
January 14, 2003
Filing Date:
July 13, 2000
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L23/28; H01L21/56; H01L21/60; H01L23/12; H01L27/10; (IPC1-7): H01L23/12; H01L21/60
Domestic Patent References:
| JP2295159A | ||||
| JP444347A | ||||
| JP6481330A |
Other References:
【文献】特許3146849(JP,B2)
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)