Title:
HIGH-FREQUENCY FUSION-BONDING APPARATUS
Document Type and Number:
Japanese Patent JPH0623844
Kind Code:
A
Abstract:
PURPOSE: To provide a sanitary an and efficient high frequency fusion-bonding apparatus reduced in installation space, capable of sufficiently withstanding long-term use and easy in reparing, maintenance or cleaning.
CONSTITUTION: A filling part, a lid attaching part 6 and a vacuum high-frequency fusion-bonding part 8 are successively arranged on a feed conveyor 2 linearly transferring containers 1 to be fusion-bonded in an arranged state and a drive mechanism moving those parts in a state well timed with a transfer speed to return them to the original positions is provided.
More Like This:
Inventors:
ICHIKAWA TAKU
Application Number:
JP20013592A
Publication Date:
February 01, 1994
Filing Date:
July 06, 1992
Export Citation:
Assignee:
SHIMADA PHYSICAL CHEM IND CO
International Classes:
B29C65/04; B29L22/00; (IPC1-7): B29C65/04
Attorney, Agent or Firm:
Shigeo Tsugamura (1 outside)
Next Patent: COLD PRESSING TOOL