PURPOSE: To reduce defective articles caused by thermal stress and improve after-curing of mold resin, by performing aging after electronic components are subjected to first heat treatment, and again performing second heat treatment.
CONSTITUTION: Fluorine based inert liquid 1 is put in a heat-treating vessel 2, and heated at about 250-300°C with a heater 3. Electronic components are arranged in the liquid 1 or the vapor phase 4, and are subjected to first heat treatment. Next the electronic components 6 are subjected to aging under specified conditions, and again subjected to second heat treatment at a temperature nearly equal to the first treatment temperature. The process time T2 is about 5-600 seconds, and the relation to the first processing time T1 is T1<T2. After the second heat treatment, characteristics of the electronic components 6 are measured, and the electronic components in which deterioration of characteristics is generated are eliminated. Thereby electronic components excellent in heat resistance can be obtained with high yield.
SUZUKI NORIAKI
TAKAKU YUUYA
NISHIJIMA YASUYO
KURIHARA KANAME
| JPS63166210A | 1988-07-09 | |||
| JPH0411716A | 1992-01-16 | |||
| JPH01261812A | 1989-10-18 |