Title:
【発明の名称】セラミック電子部品の製造方法
Document Type and Number:
Japanese Patent JP3064743
Kind Code:
B2
Inventors:
Yukio Sanada
Application Number:
JP12143793A
Publication Date:
July 12, 2000
Filing Date:
May 24, 1993
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
C23C10/32; F27D3/12; H01G4/12; H01L23/00; (IPC1-7): H01G4/12; C23C10/32; F27D3/12; H01L23/00
Domestic Patent References:
| JP645010A | ||||
| JP62115817A |
Attorney, Agent or Firm:
Fukami Hisaro (2 outside)