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Title:
METHOD AND APPARATUS FOR MOUNTING OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH0722783
Kind Code:
A
Abstract:

PURPOSE: To provide an electronic-component mounting method and its apparatus wherein measures against the abnormality of a suction nozzle can be taken at an early stage and a drop in the yield of production or in the operating rate of the apparatus can be prevented.

CONSTITUTION: A control part 19 stores image information on a suction face 12a which has been photographed by a camera 18 before an electronic component is sucked by a suction nozzle 12. The image information is compared with image information on the same suction face 12a which has been photographed by the camera 18 after the electronic component has been mounted on a printed-circuit board 17. On the basis of a compared result, the control part 19 detects the abnormality of the suction face 12a.


Inventors:
CHIMURA NAOHIKO
INUZUKA RYOJI
HIRAI WATARU
SAKURAI KUNIO
Application Number:
JP16081393A
Publication Date:
January 24, 1995
Filing Date:
June 30, 1993
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B23P21/00; A63C5/00; H05K13/04; H05K13/08; (IPC1-7): H05K13/04; B23P21/00; H05K13/08
Attorney, Agent or Firm:
Yoshihiro Morimoto



 
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