Title:
【発明の名称】ダイヤモンド粒子の加工方法
Document Type and Number:
Japanese Patent JPH0755873
Kind Code:
B2
Abstract:
For the use of diamond particles as a component part of machining tools or other tools, it is customary to hold the diamond particles in a bond, in particular a metallic bond. Retention is increased in this case if the diamond particles have a roughened surface. This can take place by etching. In the case of the known methods for processing the surface of the diamonds, they are, however, partially destroyed if processing takes place at high temperatures, that is to say in excess of 1000 DEG C, or there is a great loss of diamond material. This is overcome if, to increase their surface area to at least twice the size of their natural surface area by making pores in them, the diamond particles (1) are embedded in a metal powder and subjected to a stream of hydrogen or a hydrogen-containing gas at a temperature above 700 DEG C. Thereafter, the diamond particles (1) can be cleaned with an acid. Iron, cobalt, nickel or an alloy of these metals come into consideration as metal powder.
Inventors:
Dietrich Borze
Application Number:
JP18787187A
Publication Date:
June 14, 1995
Filing Date:
July 29, 1987
Export Citation:
Assignee:
Ernst Winter und Zone
International Classes:
B24D18/00; C01B31/06; C04B41/53; C09C1/68; C04B41/91; C30B29/04; C30B33/08; (IPC1-7): C04B41/91; C01B31/06; C30B29/04; C30B33/08
Attorney, Agent or Firm:
Takehisa Ito