Title:
【発明の名称】メタライズドポリイミドフィルムの製法
Document Type and Number:
Japanese Patent JP2775647
Kind Code:
B2
Abstract:
A process for preparing a metallized polyimide film, comprising the steps of: forming a solidified film containing 100 parts by weight of an aromatic polyamic acid in the form of a solution obtained by polymerizing approximately equal moles of an aromatic tetracarboxylic acid component and an aromatic diamine component and 5 to 150 parts by weight of an organic polar solvent; applying a surface treatment solution containing a heat-resistant surface treating agent to the surface of the solidified film; heating the solidified film to a high temperature to imidize the polyamic acid, while drying the film to prepare a polyimide film; forming a thin metal vapor-deposited layer by a vapor deposition of a metal on the treated surface of the polyimide film with the heat-resistant surface treatment agent; and applying metal plating onto the metal vapor deposited layer to form a metal plated layer thereon.
Inventors:
TAKABAYASHI SEIICHIRO
MITSUI KAZUAKI
YANO KENICHIRO
MITSUI KAZUAKI
YANO KENICHIRO
Application Number:
JP29743089A
Publication Date:
July 16, 1998
Filing Date:
November 17, 1989
Export Citation:
Assignee:
UBE KOSAN KK
International Classes:
B32B15/088; B32B7/04; B32B15/08; B32B38/00; B32B43/00; C08G73/10; C09D179/08; C23C14/20; C23C28/02; H05K1/03; H05K3/38; (IPC1-7): B32B15/08; C23C14/20; C23C28/02; H05K1/03
Domestic Patent References:
| JP6262551A | ||||
| JP6031918B2 |