Title:
【発明の名称】マイクロセンサハウジング
Document Type and Number:
Japanese Patent JP2003506703
Kind Code:
A
Abstract:
A microsensor housing having a structure with at least one inlet at one end and a thermal property sensor at the other end. Situated between the inlet and the sensor is a convection shield. Sampled fluid is taken in the inlet from a channel carrying the fluid to be sampled. The convection flow lines of the fluid are barred by the convection shield. The fluid is diffused into a cavity between the shield and sensor. The sensor detects a thermal property of the diffused fluid. One preferred shield has holes about its perimeter with a solid center part of the shield covering at a distance the sensor. The channel carrying the fluid may have screens to reduce turbulence noise and to aid in fluid transport to and from the sensor housing.
Inventors:
Bourne, Ulrich
Application Number:
JP2001515931A
Publication Date:
February 18, 2003
Filing Date:
July 27, 2000
Export Citation:
Assignee:
Honeywell Incorporated
International Classes:
G01F1/684; G01F5/00; G01N1/22; G01N25/18; G01N25/48; G01N33/00; (IPC1-7): G01N25/18
Domestic Patent References:
| JPH02141649A | 1990-05-31 | |||
| JPS5539100A | 1980-03-18 | |||
| JPH06109674A | 1994-04-22 | |||
| JPH1130602A | 1999-02-02 | |||
| JPH05240814A | 1993-09-21 | |||
| JPH04332857A | 1992-11-19 |
Foreign References:
| US4208266A | 1980-06-17 |