Title:
【発明の名称】回路部品の実装構造
Document Type and Number:
Japanese Patent JP2682477
Kind Code:
B2
Abstract:
The invention provides a circuit element mounting structure comprising: a substrate (1) having a pattern A (11) of wirings therein; at least one cavity (16a) formed at a surface of the substrate (1); and a cap (2) for covering the cavity (16a) therewith, characterized by the cap (2) including a pattern B (7) of wirings therein and a connection B (5, 5a) for electrically connecting the pattern B (7) of wirings to the pattern A (11) of wirings, and the substrate (1) including a connection A (10, 10a) for electrically connecting the connection B (5, 5a) to the pattern A (11) of wirings. In accordance with the invention, it is now possible to mount circuit elements on a cap which had been a dead space in prior circuit, and hence also possible to mount circuit elements in higher density on a substrate including a cap zone.
Inventors:
Takao Koizumi
Application Number:
JP30694094A
Publication Date:
November 26, 1997
Filing Date:
November 16, 1994
Export Citation:
Assignee:
NEC
International Classes:
H05K1/18; H01L23/04; H01L23/538; H01L23/64; H01L25/16; H01P3/08; H05K3/46; H05K1/14; (IPC1-7): H05K1/18; H01P3/08; H05K3/46
Domestic Patent References:
| JP5114776A | ||||
| JP2268489A | ||||
| JP509757A | ||||
| JP6038845A | ||||
| JP730055A | ||||
| JP473720B2 |
Attorney, Agent or Firm:
Yoji Kobashigawa