Title:
【発明の名称】パタ―ン検査装置
Document Type and Number:
Japanese Patent JP2524000
Kind Code:
B2
Abstract:
PURPOSE:To simply enable inspection of a breakage at a land part of a through hole to be conducted a method wherein a wire pattern and a through hole part are separated and the through hole part of the wire pattern is filled up and then a through hole image is expanded by a arbitrary amount, followed by a logical computation with a filling binary image. CONSTITUTION:A wire pattern of a printed circuit board 101 is lighted with a diffusion lighting device 102 from above and the results are inputted as a variable density image by an image input means 105 with a camera 104. The variable density image is turned to an image with an image signal level modulated per line in a subscanning direction of a through hole area. A binary coding means 106 compares a variable image from the means 105 with a specified threshold to be converted into a binary image. A hole separation means 107 extracts a stripe pattern of a through hole area from a binary image to obtain a through hole image and a stopping binary image with the through hole part filled up is outputted. An expansion processing means 108 expands the through hole image by an arbitrary amount and a defect detecting means 109 performs a logic computation of a filling binary image and the through hole image to detect non-coincidence area.
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Inventors:
MARUYAMA JUJI
YAMAMOTO ATSUHARU
KAWAKAMI HIDEHIKO
KAWAMURA HIDEAKI
NAKAJIMA MASAAKI
YAMAMOTO ATSUHARU
KAWAKAMI HIDEHIKO
KAWAMURA HIDEAKI
NAKAJIMA MASAAKI
Application Number:
JP2853291A
Publication Date:
August 14, 1996
Filing Date:
February 22, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
G01B11/24; G01N21/88; G01N21/956; G06T1/00; G06T7/00; H01L21/66; (IPC1-7): G01N21/88; G01B11/24; G06T7/00; H01L21/66
Attorney, Agent or Firm:
Tomoyuki Takimoto