Title:
【発明の名称】経皮的プロテーゼ
Document Type and Number:
Japanese Patent JP2003535643
Kind Code:
A
Abstract:
A transcutaneous prosthesis which includes a first component shaped for implantation into a bone, a second component intended for location between the bone and the skin, the second component having a surface treatment for stimulation of fibroblastic cell proliferation and attachment of epithelial cells, and a third component intended for location exterior to the skin surface having a low surface energy which deters bacterial adhesion.
Inventors:
Brun, gordon
Cobb, Justin
Goodship, allen
Unwin, Paul
Cobb, Justin
Goodship, allen
Unwin, Paul
Application Number:
JP2002503196A
Publication Date:
December 02, 2003
Filing Date:
June 22, 2001
Export Citation:
Assignee:
University College London
International Classes:
A61L27/00; A61C8/00; A61F2/28; A61F2/30; A61F2/78; A61L27/28; A61L27/30; A61L27/34; A61F2/00; A61F2/54; A61F2/58; A61F2/60; A61F2/66; (IPC1-7): A61F2/78; A61L27/00
Attorney, Agent or Firm:
Naozumi Ono (1 person outside)