Title:
【発明の名称】プラズマ反応器装置及び物質処理法
Document Type and Number:
Japanese Patent JP2553947
Kind Code:
B2
Abstract:
An apparatus and method for treating a substrate with an excited species removed from a plasma (15, 15a, 31, 52, 53) is described. The apparatus includes closed or open end tubes (13, 22, 30, 54 and 55) with apparatus or nozzles (16, 32, 56 and 57) for directing the excited species at a substrate (17, 33, 59) and a tunable plate or sliding short (11, 38, 39, 40) internal or external of the tubes for positioning the plasma in the tube during operation of the apparatus. Tuning or nozzle position or power variations are used. The method and apparatus is useful for depositing films, etching and the like.
Inventors:
JESU ASUMUSEN
DONII KEI RAINHAADO
DONII KEI RAINHAADO
Application Number:
JP5982090A
Publication Date:
November 13, 1996
Filing Date:
March 09, 1990
Export Citation:
Assignee:
MISHIGAN SUTEETO UNIV
International Classes:
C23C16/27; C23C16/452; C23C16/50; B01J19/08; C23C16/505; C23C16/511; C23C16/52; H01J37/32; (IPC1-7): C23C16/50; B01J19/08; C23C16/52
Domestic Patent References:
| JP61261481A |
Attorney, Agent or Firm:
Yoshiro Ishihara