【発明の名称】半導体ウエハの研磨制御装置

Title:

【発明の名称】半導体ウエハの研磨制御装置

Document Type and Number:

Japanese Patent JPH07100297

Kind Code:

B2

Inventors:

Masahiko Yamaguchi
Masato Sakai

Application Number:

JP1701587A

Publication Date:

November 01, 1995

Filing Date:

January 27, 1987

Export Citation:

Assignee:

Kyushu Electronic Metal Co., Ltd.
Osaka Titanium Manufacturing Co., Ltd.

International Classes:

B24B49/05; B23Q15/16; B24B49/02; B24B51/00; H01L21/304; (IPC1-7): B24B49/02; B23Q15/16; H01L21/304

Attorney, Agent or Firm:

Mori Masazumi

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