Title:
【発明の名称】ポリアミド樹脂組成物およびその製法
Document Type and Number:
Japanese Patent JPH0794602
Kind Code:
B2
Inventors:
Akira Ito
Yagabe Sadayuki
Yagabe Sadayuki
Application Number:
JP25203686A
Publication Date:
October 11, 1995
Filing Date:
October 24, 1986
Export Citation:
Assignee:
Asahi Chemical Industry Co., Ltd.
International Classes:
C08L25/04; C08K5/05; C08K5/09; C08L71/00; C08L71/08; C08L71/12; C08L73/00; C08L77/00; (IPC1-7): C08L71/12; C08K5/09; C08L25/04; C08L71/12; C08L77/00
Domestic Patent References:
JP63108060A | ||||
JP63241063A | ||||
JP61204263A |
Attorney, Agent or Firm:
Kazuo Watanabe
Next Patent: FABRICATION OF PLANAR SEMICONDUCTOR MEMORY DEVICE