Title:
TANK FOR SOLDER
Document Type and Number:
Japanese Patent JPH0768375
Kind Code:
A
Abstract:
PURPOSE: To prevent sticking of an oxide of solder.
CONSTITUTION: A main tank 10 in which the solder is melted, a pot 12 to which solder is sent from the tank 10 and in which the surface of melted solder is maintained at a fixed level, a pump 14 by which solder is sent from the main tank 10 to the pat 12, a shaft 18 by which the vane 16 of pump 14 is rotated and a motor 20 by which the shaft 18 is rotated are provided. A pipe 30 by which at least a part of shaft 18 from below to above the surface of melted solder is covered and the solder and shaft 18 are interrupted is also provided.
Inventors:
OGUCHI MINEICHI
Application Number:
JP14591194A
Publication Date:
March 14, 1995
Filing Date:
June 28, 1994
Export Citation:
Assignee:
SHINETSU SHOJI KK
International Classes:
B23K1/08; B23K3/06; (IPC1-7): B23K3/06; B23K1/08
Attorney, Agent or Firm:
Takao Watanuki (1 outside)
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