Title:
【発明の名称】ポリエチレン樹脂組成物およびフィルム
Document Type and Number:
Japanese Patent JP2643348
Kind Code:
B2
Abstract:
A polyethylene resin composition comprised of (A) 30 to 50% by weight of a linear low density polyethylene resin wherein (i) the MFR190 DEG C is 0.3 to 3.0/10 min, (ii) the density is 0.900 to 0.918 g/cc, (iii) the MI20/MI2 is 40 or less, (iv) there are one or more endothermic peaks of the melting point determined by a differential scanning calorimeter, wherein, when there are two or more peaks, the highest melting point (Tm1) is 118 to 125 DEG C and the ratio Tm1H/Tm2H between the endothermic peak height (Tm1H) of the highest melting point and the next low temperature side endothermic peak height (Tm2H) of 1.2 or less, and (v) the comonomer is an alpha -olefin having four or more carbon atoms; (B) 20 to 40% by weight of a high density polyethylene resin wherein (i) the MFR190 DEG C is 0.01 to 0.2 g/10 min, (ii) the density is 0.935 to 0.950 g/cc, and (iii) the /MI20/MI2 is 80 or more, (C) 10 to 40% by weight of a high pressure low density polyethylene resin wherein (i) the MFR190 DEG C is 0.1 to 2.0 g/10 min, (ii) the density is 0.915 to 0.924 g/cc, and (iii) the melt tension is 5 g or more, wherein the polyethylene resin composition is characterized in that (i) the MFR190 DEG C is 0.2 to 1.0 g/10 min, (ii) the density is 0.918 to 0.935 g/cc, and (iii) the melt tension is 5 g or more.
Inventors:
MATSUNAGA KOJI
NISHIMURA TOSHIHIRO
NISHIMURA TOSHIHIRO
Application Number:
JP21943188A
Publication Date:
August 20, 1997
Filing Date:
September 01, 1988
Export Citation:
Assignee:
MITSUI SEKYU KAGAKU KOGYO KK
International Classes:
C08J5/18; C08L23/00; C08L23/06; C08L23/08; C08L23/04; C08L23/18; (IPC1-7): C08L23/08; C08J5/18; C08L23/06
Domestic Patent References:
| JP6377957A |
Attorney, Agent or Firm:
Yanagihara