Title:
【発明の名称】ポリイミド系樹脂ペーストおよびこれを用いたIC
Document Type and Number:
Japanese Patent JP2987950
Kind Code:
B2
More Like This:
Inventors:
NISHIZAWA HIROSHI
SUZUKI KENJI
SUZUKI KENJI
Application Number:
JP799091A
Publication Date:
December 06, 1999
Filing Date:
January 25, 1991
Export Citation:
Assignee:
HITACHI KASEI KOGYO KK
International Classes:
C08L79/08; C09D179/08; H01L21/312; H01L23/29; H01L23/31; H05K3/28; H05K3/46; (IPC1-7): C08L79/08; C09D179/08; H01L21/312; H01L23/29; H01L23/31; H05K3/28; H05K3/46
Domestic Patent References:
| JP485379A | ||||
| JP3141504A | ||||
| JP398209A |
Attorney, Agent or Firm:
Kunihiko Wakabayashi