Title:
PRINTED WIRING BOARD AND ITS SOLDERING METHOD
Document Type and Number:
Japanese Patent JPH0832182
Kind Code:
A
Abstract:
PURPOSE: To provide a printed wiring board, which can held with guide claws for printed wiring boards with a thickness t=1.6mm even if it has a thickness t=3.2mm, and its soldering method for performing soldering in that condition.
CONSTITUTION: Both edges 1a and 1a of a printed wiring board 1 having a relatively large thickness t of 3.2mm are machined entirely into steps. Here, t1=1.6mm, and d=2 to 3mm. That is, this printed wiring board 1 has a thickness t=3.2mm, but both edges 1a and 1a have a thickness t=1.6mm which is the thickness of printed wiring boards generally used. And, in soldering, this printed wiring board 1 is carried by using guide claws 2 for thickness t=1.6mm.
Inventors:
YANASE NORIAKI
Application Number:
JP18664394A
Publication Date:
February 02, 1996
Filing Date:
July 15, 1994
Export Citation:
Assignee:
TOA CORP
International Classes:
H05K3/34; H05K1/02; (IPC1-7): H05K1/02; H05K3/34
Attorney, Agent or Firm:
Hiroshi Tanaka (2 outside)
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