Title:
IC SOCKET ASSEMBLY AND ITS COVER MEMBER
Document Type and Number:
Japanese Patent JPH07106037
Kind Code:
A
Abstract:
PURPOSE: To easily and securely connect an IC package, which has extremely large number of contacts, namely, 100 or more contacts or leads, with a relatively low inserting force. CONSTITUTION: An IC socket assembly is formed of an IC package 12 generally called a flat pack, a socket 10 and a cover member. The IC package 12 has multiple contacts 20 in four edges thereof. The socket 10 has multiple socket contacts 18, which makes contact with the contacts 20 of the IC package 12. The cover member is formed of four arms 16, and a recessed part 32, which is formed in one end of each arm, is connected to the other end of the other arm, so that the IC package 12 can be connected to the socket 10 per edge.
Inventors:
ARUKADEI WAI GORUBICHITSUKU
DONARUDO KIISU HAAPAA JIYUNIA
MAIKERU FUREDERITSUKU RAUBU
DEBITSUTO UEIN MATSUKUMURIN
DONARUDO KIISU HAAPAA JIYUNIA
MAIKERU FUREDERITSUKU RAUBU
DEBITSUTO UEIN MATSUKUMURIN
Application Number:
JP16706994A
Publication Date:
April 21, 1995
Filing Date:
July 19, 1994
Export Citation:
Assignee:
WHITAKER CORP
International Classes:
H01R33/76; H01L23/32; H01R13/24; H01R33/74; H05K7/10; H01R13/193; (IPC1-7): H01R33/76; H01L23/32
Attorney, Agent or Firm:
Masaki Yamada (2 others)