Title:
【発明の名称】プリント板セット治具
Document Type and Number:
Japanese Patent JP2773470
Kind Code:
B2
Abstract:
PURPOSE:To obtain a printed-circuit board setting tool which does not deforme the board even when a force is applied from both sides, can be manufactured at a low cost, hardly fails, and can cope with a printed-circuit board which is thin and light for the printed-circuit board setting tool where a single side can be pressed down at a time when the printed-circuit board is contacted and held from both sides. CONSTITUTION:When a printed-circuit board 1 between a fixed plate 9 and first and second movable plates 11 and 12 is inserted, the first movable plate 11 is moved toward the fixing plate 9 by a shifting means 15 and a tip of a second press projection portion 14 pushes the printed-circuit board 1 and allows a circuit pattern 10 or a lead of parts to contact a plurality of first probe pins 3 by a specific pressure. The printed-circuit board 1 is allowed to contact a first press projection portion 13 and second movable plate 12 which is moved toward the fixed plate 9 by the shifting means 15 with a time difference allows the tip of a plurality of second probe pins 30 to contact the circuit pattern 10 of the printed-circuit board or the lead of the parts with the specific pressure.
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Inventors:
Kenji Fujiwara
Application Number:
JP16605091A
Publication Date:
July 09, 1998
Filing Date:
July 08, 1991
Export Citation:
Assignee:
富士通株式会社
International Classes:
G01R31/00; G01R31/02; G01R31/28; G01R1/06; (IPC1-7): G01R31/28; G01R1/06; G01R31/02
Domestic Patent References:
| JP63185572U |
Attorney, Agent or Firm:
Teiichi