PURPOSE: To form easily and surely a uniform thin film by making a shutter in a sputtering chamber movable in not only a fixed direction but also other direction.

CONSTITUTION: The opening positions 2' of a shutter 2 placed in a sputtering chamber so as to prevent the deposition of an excess film on a wafer 1 are set at both sides of the wafer 1, and the shutter 2 is moved to both sides of the wafer 1 as shown by the arrows to carry out the opening and shutting of the shutter 2. The whole surface of the wafer 1 is uniformly exposed, and a thin film formed is made symmetric with respect to the central axis, so a uniform thickness can be provided to the resulting thin film.