Title:
【発明の名称】反応性ホツトメルト接着剤
Document Type and Number:
Japanese Patent JP2689992
Kind Code:
B2
Abstract:
A reactive hot-melt adhesive is described, which contains a resin component, at least one thermally activatable latent curing agent for the resin component and optionally accelerators, fillers, thixotropic agents and further conventional additives. The adhesive is characterized in that the resin component is obtainable by reacting a) an epoxy resin solid at room temperature and b) an epoxy resin liquid at room temperature with c) a linear polyoxypropylene having amino terminal groups, in which the epoxy resins a) and b) are used in such a quantity, based on the polyoxypropylene with amino terminal groups, that an excess of epoxy groups, based on the amino groups, is ensured.
Inventors:
Hubert Sienkel
Application Number:
JP20493489A
Publication Date:
December 10, 1997
Filing Date:
August 09, 1989
Export Citation:
Assignee:
Henkel, Terrorson, Gezershyaft, Mitt, Besilenktel Haftung
International Classes:
C08G59/10; C08G59/14; C08G59/22; C08G59/40; C08L63/00; C09J163/00; (IPC1-7): C09J163/00; C08L63/00
Domestic Patent References:
| JP61188478A | ||||
| JP61197664A | ||||
| JP24886A |
Attorney, Agent or Firm:
Heiyoshi Odashima