PURPOSE: To enable the increase of terminals for connection wiring without enlarging the mounting area on a printing circuit board as in the conventional even if the terminals for connection wiring of a semiconductor chip by arranging the terminals for connection wiring double-storied and alternately.

CONSTITUTION: The terminals for connection wiring are arranged double-storied and alternately. For example, a terminal A11 is one that is a part of the terminal C8 for mounting of a semiconductor chip in a conventional leadless-type ceramic chip carrier is applied for a terminal of connection wiring. The extended end of this terminal passes between the second layer 18 and the third layer 19 and is connected with a terminal Y13 of a back surface of a chip carrier through a through hole 14 of the third layer. Meanwhile, a terminal B10 passes between the first layer 17 and the second layer 18 and is connected with a back surface terminal Z12 from a side plane of the chip carrier. Thus, the arrangement of the terminals A and B is alternate so that wiring between the chip and the terminals A and B can be performed without a short or a contact among the connections.