Title:
【発明の名称】半導体封止用樹脂組成物
Document Type and Number:
Japanese Patent JP2837503
Kind Code:
B2
Inventors:
SUZUKI KENICHI
ENOKI HISAFUMI
OOKUBO HIKARI
ENOKI HISAFUMI
OOKUBO HIKARI
Application Number:
JP10544090A
Publication Date:
December 16, 1998
Filing Date:
April 23, 1990
Export Citation:
Assignee:
SUMITOMO BEEKURAITO KK
International Classes:
C08F299/00; C08F4/32; C08F8/00; C08F290/00; C08G8/30; C08G73/10; C08G77/44; C08G77/442; C08G81/00; C08K5/14; C08K5/3415; C08K5/50; C08L25/18; C08L61/14; C08L83/10; H01L23/29; H01L23/31; (IPC1-7): C08F299/00; C08F4/32; C08F290/00; C08K5/14; C08K5/3415; C08K5/50; C08L25/18; C08L61/14; C08L83/10; H01L23/29; H01L23/31
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