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Title:
PHENOL RESIN MOLDING MATERIAL FOR LOW-PRESSURE MOLDING
Document Type and Number:
Japanese Patent JPH0657098
Kind Code:
A
Abstract:

PURPOSE: To provide, through a specific process, the phenol resin molding material excellent in packability in a mold and curability in its low-pressure molding, by using a resin component composed of a crystalline phenol compound and phenol resin, a specific curing agent, inorganic fine powder, etc.

CONSTITUTION: (A) A two or more-nuclear crystalline phenol compound (e.g. bisphenol A), (B) a phenol resin, and (C) hexamethylenetetramine as curing agent, are put to melt-blending followed by incorporating the resultant composition with (D) inorganic fine powder 100nm or smaller in mean particle diameter, thus obtaining the objective molding material. It is preferable that the weight ratio A/B be (80:20) to (30:70). Specifically, this molding material can be obtained, for example, by the following process: novolak-type phenol resin, bisphenol F and hexamethylenetetramine are put to melt blending at 50°C for 30min using a roll mill, and the ground product of the resultant composition is then mixed with calcium hydroxide and/or woodmeal, etc., followed by kneading with a twin-roll mill and then grinding.


Inventors:
SAKAMOTO TSUKASA
ISHIDA TAMOTSU
SAITO HIDENORI
Application Number:
JP21144292A
Publication Date:
March 01, 1994
Filing Date:
August 07, 1992
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08K3/00; C08K5/17; C08L61/04; C08L61/12; (IPC1-7): C08L61/12; C08K3/00; C08K5/17; C08L61/12



 
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