Title:
METHOD FOR AUTOMATICALLY CARRYING OUT POLISHED WAFER
Document Type and Number:
Japanese Patent JPH0788763
Kind Code:
A
Abstract:
PURPOSE: To provide a method for automatically carrying out a polished wafer whereby the wafer can be easily carried out from a polishing device by eliminating contact with a polished surface of the wafer after ending polishing while ensuring polishing performance.
CONSTITUTION: When polishing work of a wafer 1 is ended, a pressure plate 12 is lifted with a block 2 left as sucked, and a block receiving base 21 is set onto a surface plate 5 under this lifted pressure plate 12, next to mount the block 2 on the block receiving base 21 without bringing the wafer 1 into contact. The block 2 mounted on the block receiving base 21 is held and carried out to the outside of the surface plate 5.
Inventors:
YOSHIDA TAKAFUMI
HAYASHI NOBUMITSU
ESASHI TOSHIRO
HAYASHI NOBUMITSU
ESASHI TOSHIRO
Application Number:
JP23803793A
Publication Date:
April 04, 1995
Filing Date:
September 24, 1993
Export Citation:
Assignee:
NIPPON STEEL CORP
International Classes:
B24B37/00; B24B41/06; H01L21/304; (IPC1-7): B24B41/06; B24B37/04; H01L21/304
Attorney, Agent or Firm:
Mikio Hatta
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